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surface-mount package

См. также в других словарях:

  • Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… …   Wikipedia

  • Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips …   Wikipedia

  • Mount Baker Tunnel — Mount Baker Ridge Tunnel U.S. National Register of Historic Places …   Wikipedia

  • List of electronics package dimensions — Surface mount dimension reference = C Clearance between IC body and PCB H Total Height T Lead Thickness L Total Carrier Length LW Lead Width LL Lead Length P Pitch WB IC Body Width WL Lead to Lead Width Through pin dimension reference C Clearance …   Wikipedia

  • Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads …   Wikipedia

  • Apollo 15, Lunar surface — Apollo 15 Commander David Scott and Lunar Module Pilot James Irwin spent three days on the Moon and a total of 18½ hours outside the spacecraft on lunar extra vehicular activity. The mission was the first not to land in a lunar mare, instead… …   Wikipedia

  • Dual in-line package — DIP, o Dual in line package por sus siglas en inglés, es una forma de encapsulamiento común en la construcción de circuitos integrados. La forma consiste en un bloque con dos hileras paralelas de pines, la cantidad de éstos depende de cada… …   Wikipedia Español

  • Shrink Small-Outline Package — (SSOP) is a microchip package for surface mount technology. SSOP chips have gull wing leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm).ee also*Plastic Small Outline Package (PSOP) *Thin Small Outline Package… …   Wikipedia

  • Thin small-outline package — Thin small outline packages, or TSOPs are a type of surface mount IC package. They are notably very low profile (about 1mm) and have tight lead spacing (as low as 0.5mm).They are frequently used for RAM or Flash memory ICs dues to their high pin… …   Wikipedia

  • Zig-zag in-line package — The zig zag in line package or ZIP was a short lived packaging technology for integrated circuits, particularly dynamic RAM chips. It was intended as a replacement for dual in line packaging (DIL or DIP). A ZIP is an integrated circuit… …   Wikipedia

  • Multi-leaded power package — An example of a 9 lead multi leaded power package The multi leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single… …   Wikipedia

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